MANUFACTURING METHOD OF ELECTRODE PLATE, MANUFACTURING METHOD OF SECONDARY BATTERY, ELECTRODE PLATE, AND SECONDARY BATTERY

According to the present disclosure, it is possible to decrease a sticking number of sputters to an electrode tab of an electrode plate. The herein disclosed manufacturing method of the electrode plate includes a core body exposed area cutting step for cutting a negative electrode core body exposed...

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Bibliographische Detailangaben
Hauptverfasser:	MAGARI, Yoshifumi, SUMI, Kyogo, TSUKAMOTO, Kentaro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSIONOF CHEMICAL INTO ELECTRICAL ENERGY SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	According to the present disclosure, it is possible to decrease a sticking number of sputters to an electrode tab of an electrode plate. The herein disclosed manufacturing method of the electrode plate includes a core body exposed area cutting step for cutting a negative electrode core body exposed area A2 with a laser L, on which a negative electrode core body 22 is exposed while a negative electrode active material layer is not provided, so as to form a negative electrode tab 22t. Then, regarding the herein disclosed manufacturing method of the electrode plate, the negative electrode core body 22 includes a first surface 22a and a second surface 22b that is a surface at an opposite side of the first surface 22a and whose surface roughness is smaller than the first surface 22a, and the laser L is irradiated to the first surface 22a. By doing this, it is possible to suppress the sputters from sticking to the second surface 22b, and therefore it is possible to decrease the sticking number of the sputters to the negative electrode tab 22t.