METHODS OF DETERMINING A MECHANICAL PROPERTY OF A LAYER APPLIED TO A SUBSTRATE, AND ASSOCIATED DEVICES
Disclosed is a method for determining a mechanical property of a layer applied to a substrate. The method comprises obtaining input data comprising metrology data relating to said layer and layout data relating to a layout of a pattern to be applied in said layer. A first model or first model term i...
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| creator | TABERY, Cyrus, Emil TIMOSHKOV, Vadim Yourievich KHODKO, Oleksandr ZHANG, Huaichen HAUPTMANN, Marc |
| description | Disclosed is a method for determining a mechanical property of a layer applied to a substrate. The method comprises obtaining input data comprising metrology data relating to said layer and layout data relating to a layout of a pattern to be applied in said layer. A first model or first model term is used to determine a global mechanical property related to said layer based on at least said input data; and at least one second model or at least one second model term is used to predict a mechanical property distribution or associated overlay map based on said first mechanical property and said layout data, the mechanical property distribution describing the mechanical property variation over said layer. |
| format | Patent |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES |
| title | METHODS OF DETERMINING A MECHANICAL PROPERTY OF A LAYER APPLIED TO A SUBSTRATE, AND ASSOCIATED DEVICES |
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