METHODS OF DETERMINING A MECHANICAL PROPERTY OF A LAYER APPLIED TO A SUBSTRATE, AND ASSOCIATED DEVICES

Disclosed is a method for determining a mechanical property of a layer applied to a substrate. The method comprises obtaining input data comprising metrology data relating to said layer and layout data relating to a layout of a pattern to be applied in said layer. A first model or first model term i...

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Bibliographische Detailangaben
Hauptverfasser:	TABERY, Cyrus, Emil, TIMOSHKOV, Vadim Yourievich, KHODKO, Oleksandr, ZHANG, Huaichen, HAUPTMANN, Marc
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	Disclosed is a method for determining a mechanical property of a layer applied to a substrate. The method comprises obtaining input data comprising metrology data relating to said layer and layout data relating to a layout of a pattern to be applied in said layer. A first model or first model term is used to determine a global mechanical property related to said layer based on at least said input data; and at least one second model or at least one second model term is used to predict a mechanical property distribution or associated overlay map based on said first mechanical property and said layout data, the mechanical property distribution describing the mechanical property variation over said layer.