POLYAMIDE RESIN

Provided is a polyamide resin having a high glass transition temperature and a low water absorption rate and from which a molded article that exhibits minimal deformation after water absorption is obtained. The polyamide resin includes diamine-derived structural units and dicarboxylic acid-derived s...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OKAJIMA, Yuya, OTSUKA, Kosuke
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	Provided is a polyamide resin having a high glass transition temperature and a low water absorption rate and from which a molded article that exhibits minimal deformation after water absorption is obtained. The polyamide resin includes diamine-derived structural units and dicarboxylic acid-derived structural units. More than 30 mol% of the diamine-derived structural units are derived from a diamine represented by the following formula, and more than 30 mol% of the dicarboxylic acid-derived structural units are derived from an aromatic dicarboxylic acid: