METHOD OF MANUFACTURING ELECTRONIC COMPONENT AND ELECTRONIC COMPONENT

A method of manufacturing an electronic component having a housing with terminals insert-molded thereon is provided. Each of the terminals includes a tapered portion having a tapered width and an extension portion extending from a narrow-side distal end of the tapered portion. A mold defining a cavity includes an upper die and sliding dies. The method includes: after positioning the extension portion in one of grooves formed in one surface of each of the sliding dies, sliding the sliding dies relative to the extension portion to make tip edges of opposite side surfaces of the groove facing the cavity abut against opposite side surfaces of the tapered portion; and performing molding while keeping the upper die in close contact with the one surface, and keeping part of the tapered portion and the extension portion lying in the groove held between a bottom surface of the groove and the upper die with a remaining portion of the tapered portion lying in the cavity, thus forming a connection portion protruding from the housing with the part of the tapered portion and the extension portion.