SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DIE AND METHOD FOR FORMING A SEMICONDUCTOR PACKAGE OR A SEMICONDUCTOR DIE
A semiconductor package comprises a semiconductor die and a wiring structure, which is electrically connected to the semiconductor die. Further, the semiconductor package comprises a magnetic material. The magnetic material embeds and/or encircles a portion of the wiring structure.
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| creator | MOLZER, Wolfgang GOSSNER, Harald SEIDEMANN, Georg LANGENBUCH, Michael WAIDHAS, Bernd |
| description | A semiconductor package comprises a semiconductor die and a wiring structure, which is electrically connected to the semiconductor die. Further, the semiconductor package comprises a magnetic material. The magnetic material embeds and/or encircles a portion of the wiring structure. |
| format | Patent |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDUCTANCES MAGNETS SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES SEMICONDUCTOR DEVICES TRANSFORMERS |
| title | SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DIE AND METHOD FOR FORMING A SEMICONDUCTOR PACKAGE OR A SEMICONDUCTOR DIE |
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