SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DIE AND METHOD FOR FORMING A SEMICONDUCTOR PACKAGE OR A SEMICONDUCTOR DIE

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DIE AND METHOD FOR FORMING A SEMICONDUCTOR PACKAGE OR A SEMICONDUCTOR DIE

A semiconductor package comprises a semiconductor die and a wiring structure, which is electrically connected to the semiconductor die. Further, the semiconductor package comprises a magnetic material. The magnetic material embeds and/or encircles a portion of the wiring structure.

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Bibliographische Detailangaben
Hauptverfasser: MOLZER, Wolfgang, GOSSNER, Harald, SEIDEMANN, Georg, LANGENBUCH, Michael, WAIDHAS, Bernd
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
SEMICONDUCTOR DEVICES
TRANSFORMERS
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Beschreibung
Zusammenfassung:A semiconductor package comprises a semiconductor die and a wiring structure, which is electrically connected to the semiconductor die. Further, the semiconductor package comprises a magnetic material. The magnetic material embeds and/or encircles a portion of the wiring structure.