CLEANING AGENT FOR RESIN PROCESSING MACHINES

A purging compound for removing a processing residue comprising a resin (C) to be purged, from a resin processing machine, comprising: a thermoplastic resin (A) and a non-ionic additive (B) of the following Formula (I) having a melting or softening point of lower than 150 °C:        Rn-X ...     (I)...

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Bibliographische Detailangaben
Hauptverfasser: NOBE Yohei, ENDO Shigeru, IWAI Takafumi
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:A purging compound for removing a processing residue comprising a resin (C) to be purged, from a resin processing machine, comprising: a thermoplastic resin (A) and a non-ionic additive (B) of the following Formula (I) having a melting or softening point of lower than 150 °C:        Rn-X ...     (I)(where R is a hydrophobic organic group, n is an integer of 1 or more, and X is a polar group), wherein a MFR (280 °C and a load of 2.16 kg) is 30 g/10 min or less, the difference of the solubility parameter between the resin (A) and the resin (C) is +1.6 to -1.6 (cal/cm3)1/2, the difference of the solubility parameter between the additive (B) and the resin (C) is +1.6 to -1.6 (cal/cm3)1/2, and the difference of the solubility parameter between the additive (B) and the hydrophobic organic group R is 0.7 (cal/cm3)1/2 or more.