HIGH DENSITY OPTICAL/ELECTRICAL INTERCONNECTION ARRANGEMENT WITH HIGH THERMAL EFFICIENCY

A configuration of both optical and electronic integrated circuits is formed upon a single substrate in a side-by-side arrangement, with minimal interposing elements required to direct the flow of electronic signals from one IC to another. The various sets of optical connections (typically, fiber arrays that are connected to components beyond the interconnect) are disposed around the outer periphery of the interconnect in a manner that allows for efficient access. Oriented with the substrate as top layer in stack, a heatsink may be coupled directly to exposed substrate surface and provide an efficient path for heat transfer away from the interconnection assembly.