MIXED DENSITY INTERCONNECT ARCHITECTURES USING HYBRID FAN-OUT

A semiconductor module includes two or more semiconductor dies and an interconnect structure coupled to the two or more semiconductor dies. The interconnect structure implements a plurality of die-to-die connection pathways having a first density and a plurality of fan-out redistribution pathways ha...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WILKERSON, Brett P, SWAMINATHAN, Raja, AGARWAL, Rahul
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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