MIXED DENSITY INTERCONNECT ARCHITECTURES USING HYBRID FAN-OUT

MIXED DENSITY INTERCONNECT ARCHITECTURES USING HYBRID FAN-OUT

A semiconductor module includes two or more semiconductor dies and an interconnect structure coupled to the two or more semiconductor dies. The interconnect structure implements a plurality of die-to-die connection pathways having a first density and a plurality of fan-out redistribution pathways ha...

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Bibliographische Detailangaben
Hauptverfasser: WILKERSON, Brett P, SWAMINATHAN, Raja, AGARWAL, Rahul
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A semiconductor module includes two or more semiconductor dies and an interconnect structure coupled to the two or more semiconductor dies. The interconnect structure implements a plurality of die-to-die connection pathways having a first density and a plurality of fan-out redistribution pathways having a second density that is different from the first density.