HOUSING FOR A POWER SEMICONDUCTOR MODULE ARRANGEMENT

An arrangement comprises a housing and a printed circuit board arranged vertically above the housing, wherein the housing comprises sidewalls, at least one protrusion attached to the sidewalls and arranged on the outside of the housing at a lower end of the housing distant from the printed circuit b...

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Bibliographische Detailangaben
Hauptverfasser:	ARENS, Andre, HERBRANDT, Alexander, BRAEUTIGAM, Philipp, LUDWIG, Marco
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES THERMAL INSULATION IN GENERAL WEAPONS
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