HOUSING FOR A POWER SEMICONDUCTOR MODULE ARRANGEMENT

An arrangement comprises a housing and a printed circuit board arranged vertically above the housing, wherein the housing comprises sidewalls, at least one protrusion attached to the sidewalls and arranged on the outside of the housing at a lower end of the housing distant from the printed circuit b...

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Bibliographische Detailangaben
Hauptverfasser:	ARENS, Andre, HERBRANDT, Alexander, BRAEUTIGAM, Philipp, LUDWIG, Marco
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS ORMACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS,CLIPS, WEDGES, JOINTS OR JOINTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVEFUNCTIONING OF MACHINES OR INSTALLATIONS HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES THERMAL INSULATION IN GENERAL WEAPONS
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Beschreibung
Zusammenfassung:	An arrangement comprises a housing and a printed circuit board arranged vertically above the housing, wherein the housing comprises sidewalls, at least one protrusion attached to the sidewalls and arranged on the outside of the housing at a lower end of the housing distant from the printed circuit board, wherein at least one first through hole is provided in the at least one protrusion, a plurality of holding devices, wherein each holding device is arranged inside a first through hole and/or between the printed circuit board and the first through hole, and a plurality of fastening elements configured to attach the housing to a heat sink or base plate, wherein each of the plurality of holding devices is configured to clamp a different one of the fastening elements such that the fastening elements are secured in defined positions, and to align each of the fastening elements with a different one of the first through holes, the printed circuit board comprises a plurality of second through holes, wherein each of the second through holes is arranged vertically above and aligned with a different one of the plurality of fastening elements, a diameter of each of the second through holes is less than the largest diameter of the respective fastening element, and when a defined force is exerted on the fastening elements, the fastening elements are configured to move vertically through the respective first through holes in a direction away from the printed circuit board.