HEAT-CURABLE RESIN COMPOSITION AND SEMICONDUCTOR DEVICE

The present invention is a thermosetting resin composition, including: (A) a thermosetting resin; (B) a laser direct structuring additive; (C) an inorganic filler; and (D) a coupling agent, wherein (D) the coupling agent contains one or more selected from the group consisting of a triazine functiona...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YOKOTA, Ryuhei, OSADA, Shoichi, KAWAMURA, Norifumi, HORIGOME, Hiroki, HAGIWARA, Kenji
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention is a thermosetting resin composition, including: (A) a thermosetting resin; (B) a laser direct structuring additive; (C) an inorganic filler; and (D) a coupling agent, wherein (D) the coupling agent contains one or more selected from the group consisting of a triazine functional group-, isocyanate functional group-, isocyanuric acid functional group-, benzotriazole functional group-, acid anhydride functional group-, azasilacyclopentane functional group-, imidazole functional group-, and unsaturated group-containing-silane coupling agent, and is not a mercaptosilane coupling agent, an amino silane coupling agent, or an epoxy silane coupling agent. This provides a thermosetting resin composition that gives a cured material on a surface of which a plating layer is formed without the plating layer peeling away from the cured material, and the cured material generates no cracks.