A METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE BY USING A REACTIVE TAPE AND A SEMICONDUCTOR DEVICE MODULE

A METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE BY USING A REACTIVE TAPE AND A SEMICONDUCTOR DEVICE MODULE

A method (100) for fabricating a semiconductor device module comprises providing a substrate comprising one or more semiconductor dies disposed thereon (110), providing a housing (120), applying a reactive tape on partial surfaces of one or both of the substrate and the housing (130), mounting the h...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HERZER, Anita
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:A method (100) for fabricating a semiconductor device module comprises providing a substrate comprising one or more semiconductor dies disposed thereon (110), providing a housing (120), applying a reactive tape on partial surfaces of one or both of the substrate and the housing (130), mounting the housing onto the substrate (140), filling in a potting material into the interior of the housing (150), and curing the potting material and the reactive tape (160).