DISTRIBUTION BODY FOR DISTRIBUTING A PROCESS GAS FOR TREATING A SUBSTRATE BY MEANS OF THE PROCESS GAS

The disclosure relates to a distribution body (1) for distributing a process gas (7) relative to a substrate (9) to treat the substrate (9) by means of the process gas (7), comprising a distribution plate (2), at least one gas inlet channel (3), a plurality of gas distribution channels (4), and a pl...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KOLITSCH-MATALN, Marianne, OKORN-SCHMIDT, Harald, GLEISSNER, Andreas
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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