DISTRIBUTION BODY FOR DISTRIBUTING A PROCESS GAS FOR TREATING A SUBSTRATE BY MEANS OF THE PROCESS GAS

The disclosure relates to a distribution body (1) for distributing a process gas (7) relative to a substrate (9) to treat the substrate (9) by means of the process gas (7), comprising a distribution plate (2), at least one gas inlet channel (3), a plurality of gas distribution channels (4), and a pl...

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Bibliographische Detailangaben
Hauptverfasser:	KOLITSCH-MATALN, Marianne, OKORN-SCHMIDT, Harald, GLEISSNER, Andreas
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The disclosure relates to a distribution body (1) for distributing a process gas (7) relative to a substrate (9) to treat the substrate (9) by means of the process gas (7), comprising a distribution plate (2), at least one gas inlet channel (3), a plurality of gas distribution channels (4), and a plurality of gas extraction channels (5), wherein the gas inlet channel (3) extends from a lateral surface of the distribution plate (2) to an interior of the distribution plate (2), wherein the gas distribution channels (4) branch off from the at least one gas inlet channel (3) and extend to a substrate-facing surface (6) of the distribution plate (2) to supply process gas (7) to the substrate (9) to be treated, wherein the gas distribution channels (4) are directed essentially perpendicular to the substrate-facing surface (6), and wherein the gas extraction channels (5) extend from the substrate-facing surface (6) to a another surface (10) of the distribution plate (2) to convey gas away from the substrate (9). Further, the disclosure relates to a deposition system (14) an a method for distributing a process gas (7) relative to a substrate (9) to treat the substrate (9) by means of the process gas (7).