HEAT SINK ASSEMBLY AND POWER CONVERTER ASSEMBLY

A heat sink assembly for semiconductor components includes a first and second heat sinks, each having a component and cooling fin side, which is provided with cooling fins arranged one behind another such that a cooling medium initially flows in a flow direction through cooling channels formed by th...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	KÖGLER, Roman, SCHWINN, Thomas, NAMYSLO, Lutz
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	A heat sink assembly for semiconductor components includes a first and second heat sinks, each having a component and cooling fin side, which is provided with cooling fins arranged one behind another such that a cooling medium initially flows in a flow direction through cooling channels formed by the cooling fins of the first heat sink and subsequently flows through cooling channels formed by the cooling fins of the second heat sink, wherein a first inlet cross-section which, on an inlet side of the first heat sink, composed of individual cross-sections of the associated cooling channels of the first heat sink, is reduced via a partition partially covering the cooling channels on the inlet side of the first heat sink, and a second inlet cross-section which, on an inlet side of the second heat sink, is composed of individual cross-sections of the associated cooling channels of the second heat sink.