PACKAGE INCLUDING A SUBSTRATE WITH HIGH RESOLUTION RECTANGULAR CROSS-SECTION INTERCONNECTS

A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in t...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	BRUNNER, Sebastian
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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