PACKAGE INCLUDING A SUBSTRATE WITH HIGH RESOLUTION RECTANGULAR CROSS-SECTION INTERCONNECTS

PACKAGE INCLUDING A SUBSTRATE WITH HIGH RESOLUTION RECTANGULAR CROSS-SECTION INTERCONNECTS

A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in t...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: BRUNNER, Sebastian
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:A package that includes an integrated device, a substrate coupled to the integrated device, and an encapsulation layer coupled to the substrate. The encapsulation layer encapsulates the integrated device. The substrate includes at least one dielectric layer, a plurality of interconnects located in the at least one dielectric layer, wherein at least one of the interconnects has a rectangular side cross-section having at least one corner with a corner radius less than a corner radius threshold.