MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE
The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. A fir...
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| creator | WATANABE, Naoki MIZUGUCHI, Denichirou TOKUDA, Kaya OKUYAMA, Tetsuo MAEDA, Satoshi YONEMUSHI, Harumi |
| description | The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. A first multilayer body of a first highly heat-resistant film and an inorganic substrate, said first multilayer body using substantially no adhesive and having the features (1) to (4) described below:(1) The tensile elastic modulus of the first highly heat-resistant film is 4 GPa or more.(2) The bonding strength between the first highly heat-resistant film and the inorganic substrate is 0.3 N/cm or less.(3) The surface roughness Ra of a surface of the first highly heat-resistant film, said surface being in contact with the inorganic substrate, is 5 nm or less.(4) The surface roughness Ra of the surface of the inorganic substrate after removal of the first highly heat-resistant film from the first multilayer body is 3 nm or less. |
| format | Patent |
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A first multilayer body of a first highly heat-resistant film and an inorganic substrate, said first multilayer body using substantially no adhesive and having the features (1) to (4) described below:(1) The tensile elastic modulus of the first highly heat-resistant film is 4 GPa or more.(2) The bonding strength between the first highly heat-resistant film and the inorganic substrate is 0.3 N/cm or less.(3) The surface roughness Ra of a surface of the first highly heat-resistant film, said surface being in contact with the inorganic substrate, is 5 nm or less.(4) The surface roughness Ra of the surface of the inorganic substrate after removal of the first highly heat-resistant film from the first multilayer body is 3 nm or less.</description><language>eng ; fre ; ger</language><subject>ADVERTISING ; CRYPTOGRAPHY ; DISPLAY ; DISPLAYING ; EDUCATION ; LABELS OR NAME-PLATES ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; PHYSICS ; SEALS ; SIGNS ; TRANSPORTING</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240814&DB=EPODOC&CC=EP&NR=4186695A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240814&DB=EPODOC&CC=EP&NR=4186695A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WATANABE, Naoki</creatorcontrib><creatorcontrib>MIZUGUCHI, Denichirou</creatorcontrib><creatorcontrib>TOKUDA, Kaya</creatorcontrib><creatorcontrib>OKUYAMA, Tetsuo</creatorcontrib><creatorcontrib>MAEDA, Satoshi</creatorcontrib><creatorcontrib>YONEMUSHI, Harumi</creatorcontrib><title>MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE</title><description>The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. A first multilayer body of a first highly heat-resistant film and an inorganic substrate, said first multilayer body using substantially no adhesive and having the features (1) to (4) described below:(1) The tensile elastic modulus of the first highly heat-resistant film is 4 GPa or more.(2) The bonding strength between the first highly heat-resistant film and the inorganic substrate is 0.3 N/cm or less.(3) The surface roughness Ra of a surface of the first highly heat-resistant film, said surface being in contact with the inorganic substrate, is 5 nm or less.(4) The surface roughness Ra of the surface of the inorganic substrate after removal of the first highly heat-resistant film from the first multilayer body is 3 nm or less.</description><subject>ADVERTISING</subject><subject>CRYPTOGRAPHY</subject><subject>DISPLAY</subject><subject>DISPLAYING</subject><subject>EDUCATION</subject><subject>LABELS OR NAME-PLATES</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICS</subject><subject>SEALS</subject><subject>SIGNS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2024</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDwDfUJ8fRxjHQNUnDyd4lUcPRzUfB1DfHwd1Fw8w9SCAjydwl19vRzV3DzcY3wdPJxVXBxDfN0duVhYE1LzClO5YXS3AwKbq4hzh66qQX58anFBYnJqXmpJfGuASaGFmZmlqaOJsZEKAEAD4MoEg</recordid><startdate>20240814</startdate><enddate>20240814</enddate><creator>WATANABE, Naoki</creator><creator>MIZUGUCHI, Denichirou</creator><creator>TOKUDA, Kaya</creator><creator>OKUYAMA, Tetsuo</creator><creator>MAEDA, Satoshi</creator><creator>YONEMUSHI, Harumi</creator><scope>EVB</scope></search><sort><creationdate>20240814</creationdate><title>MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE</title><author>WATANABE, Naoki ; MIZUGUCHI, Denichirou ; TOKUDA, Kaya ; OKUYAMA, Tetsuo ; MAEDA, Satoshi ; YONEMUSHI, Harumi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4186695A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2024</creationdate><topic>ADVERTISING</topic><topic>CRYPTOGRAPHY</topic><topic>DISPLAY</topic><topic>DISPLAYING</topic><topic>EDUCATION</topic><topic>LABELS OR NAME-PLATES</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICS</topic><topic>SEALS</topic><topic>SIGNS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>WATANABE, Naoki</creatorcontrib><creatorcontrib>MIZUGUCHI, Denichirou</creatorcontrib><creatorcontrib>TOKUDA, Kaya</creatorcontrib><creatorcontrib>OKUYAMA, Tetsuo</creatorcontrib><creatorcontrib>MAEDA, Satoshi</creatorcontrib><creatorcontrib>YONEMUSHI, Harumi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WATANABE, Naoki</au><au>MIZUGUCHI, Denichirou</au><au>TOKUDA, Kaya</au><au>OKUYAMA, Tetsuo</au><au>MAEDA, Satoshi</au><au>YONEMUSHI, Harumi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE</title><date>2024-08-14</date><risdate>2024</risdate><abstract>The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. A first multilayer body of a first highly heat-resistant film and an inorganic substrate, said first multilayer body using substantially no adhesive and having the features (1) to (4) described below:(1) The tensile elastic modulus of the first highly heat-resistant film is 4 GPa or more.(2) The bonding strength between the first highly heat-resistant film and the inorganic substrate is 0.3 N/cm or less.(3) The surface roughness Ra of a surface of the first highly heat-resistant film, said surface being in contact with the inorganic substrate, is 5 nm or less.(4) The surface roughness Ra of the surface of the inorganic substrate after removal of the first highly heat-resistant film from the first multilayer body is 3 nm or less.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | ADVERTISING CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION LABELS OR NAME-PLATES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PHYSICS SEALS SIGNS TRANSPORTING |
| title | MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE |
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