MULTILAYER BODY AND METHOD FOR PRODUCING FLEXIBLE DEVICE

The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. A fir...

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Bibliographische Detailangaben
Hauptverfasser:	WATANABE, Naoki, MIZUGUCHI, Denichirou, TOKUDA, Kaya, OKUYAMA, Tetsuo, MAEDA, Satoshi, YONEMUSHI, Harumi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADVERTISING CRYPTOGRAPHY DISPLAY DISPLAYING EDUCATION LABELS OR NAME-PLATES LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS PHYSICS SEALS SIGNS TRANSPORTING
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Beschreibung
Zusammenfassung:	The present invention provides a multilayer body of an inorganic substrate and a highly heat-resistant film, wherein the surface of the inorganic substrate is sufficiently smooth after removal of the highly heat-resistant film from the multilayer body, and the inorganic substrate is re-usable. A first multilayer body of a first highly heat-resistant film and an inorganic substrate, said first multilayer body using substantially no adhesive and having the features (1) to (4) described below:(1) The tensile elastic modulus of the first highly heat-resistant film is 4 GPa or more.(2) The bonding strength between the first highly heat-resistant film and the inorganic substrate is 0.3 N/cm or less.(3) The surface roughness Ra of a surface of the first highly heat-resistant film, said surface being in contact with the inorganic substrate, is 5 nm or less.(4) The surface roughness Ra of the surface of the inorganic substrate after removal of the first highly heat-resistant film from the first multilayer body is 3 nm or less.