ARRANGEMENT FOR COOLING AND MOTOR MODULE

ARRANGEMENT FOR COOLING AND MOTOR MODULE

An arrangement for cooling semiconductor components includes a cooling body base with a component side and a structural element side opposite the component side, wherein the semiconductor components are arrangeable in succession in the flow direction of a cooling medium, the structural element side...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: KÖGLER, Roman, SCHWINN, Thomas, NAMYSLO, Lutz
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An arrangement for cooling semiconductor components includes a cooling body base with a component side and a structural element side opposite the component side, wherein the semiconductor components are arrangeable in succession in the flow direction of a cooling medium, the structural element side are configured to increase its surface area by structural elements, and the structural element side is configured such that a density of structural elements involved in the cooling increases in the flow direction with regard to cooling zones.