THERMOPLASTIC COMPOSITIONS HAVING LOW DIELECTRIC PROPERTIES AND GOOD MECHANICAL PERFORMANCE
Thermoplastic compositions include: (a) from about 40 wt% to about 90 wt% of a polymer resin including poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) from about 20 wt% to about 50 wt% of a reinforcing filler including glass fiber; and (c) from about 1 wt% to about 20...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KUNG, Edward HE, Yunfei ZHENG, Yun WANG, Jian |
| description | Thermoplastic compositions include: (a) from about 40 wt% to about 90 wt% of a polymer resin including poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) from about 20 wt% to about 50 wt% of a reinforcing filler including glass fiber; and (c) from about 1 wt% to about 20 wt% of an impact modifier comprising a di-block copolymer. The thermoplastic compositions are useful in consumer electronics (CE) articles, including a mobile phone or tablet, and specifically an antenna split for a mobile phone or tablet. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP4185641A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP4185641A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP4185641A13</originalsourceid><addsrcrecordid>eNqNyrEKwjAQgOEuDqK-w72AQ7GK63G9NgdJLiRBB4dSJE6ihfr-2MEHcPqH_1tXt2w4Og0WUxYCUhc0SRb1CQxexPdg9QqtsGXKcSEhauCYhROgb6FXbcExGfRCaGF5nUaHnnhbrR7jcy67XzcVdJzJ7Mv0Hso8jffyKp-BQ1Ofj6emxvrwB_kCZ7wyEQ</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>THERMOPLASTIC COMPOSITIONS HAVING LOW DIELECTRIC PROPERTIES AND GOOD MECHANICAL PERFORMANCE</title><source>esp@cenet</source><creator>KUNG, Edward ; HE, Yunfei ; ZHENG, Yun ; WANG, Jian</creator><creatorcontrib>KUNG, Edward ; HE, Yunfei ; ZHENG, Yun ; WANG, Jian</creatorcontrib><description>Thermoplastic compositions include: (a) from about 40 wt% to about 90 wt% of a polymer resin including poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) from about 20 wt% to about 50 wt% of a reinforcing filler including glass fiber; and (c) from about 1 wt% to about 20 wt% of an impact modifier comprising a di-block copolymer. The thermoplastic compositions are useful in consumer electronics (CE) articles, including a mobile phone or tablet, and specifically an antenna split for a mobile phone or tablet.</description><language>eng ; fre ; ger</language><subject>CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230531&DB=EPODOC&CC=EP&NR=4185641A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230531&DB=EPODOC&CC=EP&NR=4185641A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUNG, Edward</creatorcontrib><creatorcontrib>HE, Yunfei</creatorcontrib><creatorcontrib>ZHENG, Yun</creatorcontrib><creatorcontrib>WANG, Jian</creatorcontrib><title>THERMOPLASTIC COMPOSITIONS HAVING LOW DIELECTRIC PROPERTIES AND GOOD MECHANICAL PERFORMANCE</title><description>Thermoplastic compositions include: (a) from about 40 wt% to about 90 wt% of a polymer resin including poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) from about 20 wt% to about 50 wt% of a reinforcing filler including glass fiber; and (c) from about 1 wt% to about 20 wt% of an impact modifier comprising a di-block copolymer. The thermoplastic compositions are useful in consumer electronics (CE) articles, including a mobile phone or tablet, and specifically an antenna split for a mobile phone or tablet.</description><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyrEKwjAQgOEuDqK-w72AQ7GK63G9NgdJLiRBB4dSJE6ihfr-2MEHcPqH_1tXt2w4Og0WUxYCUhc0SRb1CQxexPdg9QqtsGXKcSEhauCYhROgb6FXbcExGfRCaGF5nUaHnnhbrR7jcy67XzcVdJzJ7Mv0Hso8jffyKp-BQ1Ofj6emxvrwB_kCZ7wyEQ</recordid><startdate>20230531</startdate><enddate>20230531</enddate><creator>KUNG, Edward</creator><creator>HE, Yunfei</creator><creator>ZHENG, Yun</creator><creator>WANG, Jian</creator><scope>EVB</scope></search><sort><creationdate>20230531</creationdate><title>THERMOPLASTIC COMPOSITIONS HAVING LOW DIELECTRIC PROPERTIES AND GOOD MECHANICAL PERFORMANCE</title><author>KUNG, Edward ; HE, Yunfei ; ZHENG, Yun ; WANG, Jian</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4185641A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS</topic><toplevel>online_resources</toplevel><creatorcontrib>KUNG, Edward</creatorcontrib><creatorcontrib>HE, Yunfei</creatorcontrib><creatorcontrib>ZHENG, Yun</creatorcontrib><creatorcontrib>WANG, Jian</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUNG, Edward</au><au>HE, Yunfei</au><au>ZHENG, Yun</au><au>WANG, Jian</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMOPLASTIC COMPOSITIONS HAVING LOW DIELECTRIC PROPERTIES AND GOOD MECHANICAL PERFORMANCE</title><date>2023-05-31</date><risdate>2023</risdate><abstract>Thermoplastic compositions include: (a) from about 40 wt% to about 90 wt% of a polymer resin including poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) from about 20 wt% to about 50 wt% of a reinforcing filler including glass fiber; and (c) from about 1 wt% to about 20 wt% of an impact modifier comprising a di-block copolymer. The thermoplastic compositions are useful in consumer electronics (CE) articles, including a mobile phone or tablet, and specifically an antenna split for a mobile phone or tablet.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP4185641A1 |
| source | esp@cenet |
| subjects | CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS |
| title | THERMOPLASTIC COMPOSITIONS HAVING LOW DIELECTRIC PROPERTIES AND GOOD MECHANICAL PERFORMANCE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-22T22%3A52%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KUNG,%20Edward&rft.date=2023-05-31&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP4185641A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |