THERMOPLASTIC COMPOSITIONS HAVING LOW DIELECTRIC PROPERTIES AND GOOD MECHANICAL PERFORMANCE

THERMOPLASTIC COMPOSITIONS HAVING LOW DIELECTRIC PROPERTIES AND GOOD MECHANICAL PERFORMANCE

Thermoplastic compositions include: (a) from about 40 wt% to about 90 wt% of a polymer resin including poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) from about 20 wt% to about 50 wt% of a reinforcing filler including glass fiber; and (c) from about 1 wt% to about 20...

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Bibliographische Detailangaben
Hauptverfasser: KUNG, Edward, HE, Yunfei, ZHENG, Yun, WANG, Jian
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Zusammenfassung:Thermoplastic compositions include: (a) from about 40 wt% to about 90 wt% of a polymer resin including poly(cyclohexylenedimethylene terephthalate) (PCT) or a copolymer thereof; (b) from about 20 wt% to about 50 wt% of a reinforcing filler including glass fiber; and (c) from about 1 wt% to about 20 wt% of an impact modifier comprising a di-block copolymer. The thermoplastic compositions are useful in consumer electronics (CE) articles, including a mobile phone or tablet, and specifically an antenna split for a mobile phone or tablet.