COMPOSITION FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND AND POLYMER FOR FORMING ORGANIC FILM

The present invention is a composition for forming an organic film, containing: a material for forming an organic film shown by the following general formula (I) and/or general formula (II); and an organic solvent, where R1 and R4 each represent a hydrogen atom, an allyl group, or a propargyl group, R2 and R5 each represent a substituent, R3 and R6 represents a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, an alkynyl group having 2 to 4 carbon atoms, or an alkenyl group having 2 to 4 carbon atoms. "m" and "i" represent 0 or 1, "k" and "q" represent an integer of 0 to 2, "n" represent 1 or 2, "h", and "j" represent an integer of 0 to 2 and satisfy the relationship 1 ≤ h + j ≤ 4, and "l" and "r" represent 0 or 1. W represents a single bond or any divalent group shown by the following formulae (3). Each V independently represents a hydrogen atom or a linking moiety. This provides: a compound and a polymer which allow the formation of an organic film having excellent heat resistance, excellent properties of filling and planarizing a pattern, and favorable film-formability and adhesiveness to a substrate; and a composition for forming an organic film containing the compound and/or polymer.