MOLDED ARTICLE AND METHOD FOR MANUFACTURING MOLDED ARTICLE

ProblemTo inexpensively provide a molded article in which a circuit sheet is inserted.Solution meansIn a first step, a circuit sheet 20 is set such that a first region AR1 of a second main surface 22 of the circuit sheet 20 is in contact with a plateau portion 110 of a first mold 101 and a second re...

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Bibliographische Detailangaben
Hauptverfasser:	ASAI, Koji, HIRAI, Hitoshi, YAMAZAKI, Seiichi, HIGASHIKAWA, Toshihiro, MATSUMOTO, Yuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	ProblemTo inexpensively provide a molded article in which a circuit sheet is inserted.Solution meansIn a first step, a circuit sheet 20 is set such that a first region AR1 of a second main surface 22 of the circuit sheet 20 is in contact with a plateau portion 110 of a first mold 101 and a second region AR2 is not in contact with the first mold 101. In the first step, a first fixed portion of the circuit sheet 20 is arranged on a first portion Pa1 of the first mold 101, and a second fixed portion is arranged on a second portion Pa2 of the first mold 101. The first portion Pa1 is a portion that is higher than the plateau portion 110 and runs along at least one of a first protruding portion 121 and a second protruding portion 122 provided along the plateau portion 110. The second portion Pa2 is a portion where the first protruding portion 121 or the second protruding portion 122 is not provided along the plateau portion 110.