POLYETHYLENE COMPOSITIONS AND FILMS INCLUDING POLYETHYLENE COMPOSITIONS

Polyethylene compositions are disclosed that may have a density of 0.910 g/cm3 to 0.924 g/cm3 and a melt index (I2) In of 0.1 g/10 minutes to 0.5 g/10 minutes and include a first polyethylene fraction area in the temperature range from 45° C. to 80° C. of an elution profile via improved comonomer co...

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Bibliographische Detailangaben
Hauptverfasser:	SANDKUEHLER, Peter Hermann Roland, ZOGG, Michael J., Jr, DEMIRORS, Mehmet, BISWAS, Sanjib, GILLESPIE, David T
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP WORKING-UP
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Beschreibung
Zusammenfassung:	Polyethylene compositions are disclosed that may have a density of 0.910 g/cm3 to 0.924 g/cm3 and a melt index (I2) In of 0.1 g/10 minutes to 0.5 g/10 minutes and include a first polyethylene fraction area in the temperature range from 45° C. to 80° C. of an elution profile via improved comonomer composition distribution (iCCD) analysis method; a second polyethylene fraction area in the temperature range from 80° C. to 95° C. of the elution profile, and a third polyethylene fraction area in the temperature range from 95° C. to 110° C. of the elution profile. The second polyethylene fraction area may include at least 5% of the total area of the elution profile. The third polyethylene fraction area may include at least 25% of the total area of the elution profile. A ratio of the first polyethylene fraction area to the second polyethylene fraction area may be from 6 to 15.