WATER-DISPERSIBLE RESIN COMPOSITION

The present invention is a water-dispersible resin composition containing: a resin α that includes, in the main chain thereof, a structure M having two aromatic rings linked by a sulfide group, a sulfonyl group, an imide group, or a keto group; and a resin β having a hydrophilic group, the resins α...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	YOSHIMURA, Tadanori, ONOUE, Akihiro
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADDITIVE MANUFACTURING TECHNOLOGY ADDITIVE MANUFACTURING, i.e. MANUFACTURING OFTHREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVEAGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING,STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	The present invention is a water-dispersible resin composition containing: a resin α that includes, in the main chain thereof, a structure M having two aromatic rings linked by a sulfide group, a sulfonyl group, an imide group, or a keto group; and a resin β having a hydrophilic group, the resins α and β being configured to form a co-continuous structure including three-dimensional continuous phases of the resins α and β. The present invention can provide a water-dispersible resin composition that maintains the heat resistance of the polymer material and can be removed only with water.