SEMICONDUCTOR DIES AND DEVICES WITH A COIL FOR INDUCTIVE COUPLING
A semiconductor die is disclosed, including circuitry comprising a transistor at a frontside of a semiconductor substrate, and a backside inductor at a backside of the semiconductor substrate. The backside inductor is electrically connected to the transistor of the circuitry.
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A semiconductor die is disclosed, including circuitry comprising a transistor at a frontside of a semiconductor substrate, and a backside inductor at a backside of the semiconductor substrate. The backside inductor is electrically connected to the transistor of the circuitry. |
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