SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR CHIP BONDED BETWEEN A FIRST, PLATE-SHAPED ELECTRODE WITH A GROOVE AND A SECOND ELECTRODE

A semiconductor device (200) includes: a semiconductor chip (1a) including a first main electrode (D) on one surface thereof and a second main electrode (S) and a gate electrode on the other surface thereof; a first electrode (1g) connected to the first main electrode (D) of the semiconductor chip (...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ONDA, Tomohiro, ASHIDA, Kisho, TAKEDA, Naoki, HARUBEPPU, Yu, TANIE, Hisashi, NAKAMURA, Masato
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!