METHOD FOR JOINING DISSIMILAR MATERIALS AND JOINT OF DISSIMILAR MATERIALS

A method for joining dissimilar materials includes forming a first recess (100) and a second recess (110) by irradiating a surface of a first member (10) with laser light, the first recess (100) and the second recess (110) being cut into the surface obliquely at angles different from each other, and...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	Ueyama, Tomoyuki, Miyauchi, Takaaki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method for joining dissimilar materials includes forming a first recess (100) and a second recess (110) by irradiating a surface of a first member (10) with laser light, the first recess (100) and the second recess (110) being cut into the surface obliquely at angles different from each other, and joining the second member (20) to the surface of the first member (10) with a part of the second member (20) engaging with each of the first recess (100) and the second recess (110) by melting the part of the second member (20) lower in melting point than the first member (10) to cause the part of the second member (20) to flow into each of the first recess (100) and the second recess (110) and solidifying the part of the second member (20).