METHOD FOR MANUFACTURING DIELECTRIC SHEET, METHOD FOR MANUFACTURING SUBSTRATE FOR HIGH-FREQUENCY PRINTED CIRCUIT BOARD, DIELECTRIC SHEET, AND SUBSTRATE FOR HIGH-FREQUENCY PRINTED CIRCUIT BOARD

A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusio...

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Bibliographische Detailangaben
Hauptverfasser:	NINOMIYA, Takashi, OKUDA, Yasuhiro, KIYA, Satoshi, SUGIURA, Motohiko, OKAMOTO, Kentaro, KASHIHARA, Hideki, KAIMORI, Shingo, TOKUDA, Chiaki, NAKABAYASHI, Makoto
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
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Beschreibung
Zusammenfassung:	A method for manufacturing a dielectric sheet, includes the steps of extrusion molding a mixture including powder polytetrafluoroethylene and spherical silica at a temperature lower than or equal to a melting point of the polytetrafluoroethylene, and calendering a sheet body obtained by the extrusion molding, wherein a mass ratio of the silica with respect to the polytetrafluoroethylene is 1.3 or greater, an average particle diameter of the silica is 0.1 µm or greater but 3.0 pm or less, and a reduction ratio of the extrusion molding is 8 or less.