ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

An electronic device (10) includes a first metal layer (1061), a first insulating layer (110), a second metal layer (1161) and a second insulating layer (1121). The first insulating layer (110) is disposed on the first metal layer (1061), the second metal layer (1161) is disposed on the first insula...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: KAO, Ker-Yih, TSENG, Hung-I
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:An electronic device (10) includes a first metal layer (1061), a first insulating layer (110), a second metal layer (1161) and a second insulating layer (1121). The first insulating layer (110) is disposed on the first metal layer (1061), the second metal layer (1161) is disposed on the first insulating layer (110), and the second insulating layer (1121) is disposed between the second metal layer (1161) and the first insulating layer (110). The second metal layer (1161) is electrically connected to the first metal layer (1061) through a first opening (OP11) of the first insulating layer (110) and a second opening (OP21) of the second insulating layer (1121).