SEMICONDUCTOR MODULE WITH A COOLING BODY

A heat sink includes a mounting surface for arrangement of a semiconductor element. The mounting surface is formed with an open groove. An electrical line is arranged at least in part in the groove and has a connection region for connection of the semiconductor element.

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Bibliographische Detailangaben
Hauptverfasser:	SCHMENGER, Jens, SCHIERLING, Hubert
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	A heat sink includes a mounting surface for arrangement of a semiconductor element. The mounting surface is formed with an open groove. An electrical line is arranged at least in part in the groove and has a connection region for connection of the semiconductor element.