HIGH-DENSITY FLIP CHIP PACKAGE FOR WIRELESS TRANSCEIVERS

An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	ASURI, Bhushan Shanti, CHAMAS, Ibrahim Ramez, ABOUZIED, Mohamed
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	An RF flip chip is provided in which a local bump region adjacent a die corner includes a balun having a centrally-located bump.