METHOD FOR STRUCTURALLY CONNECTING ELECTRICALLY CONDUCTIVE PLASTIC SUBSTRATES USING HEAT-CURING ADHESIVES, MORE PARTICULARLY IN COMBINATION WITH METAL SUBSTRATES

The present invention relates to a method for bonding heat-stable substrates, comprising the following steps: i) applying a heat-curing adhesive composition KL to the surface of a first substrate S1, ii) bringing the applied heat-curing adhesive composition KL into contact with the surface of a second substrate S2, wherein one or both substrates, more particularly only one substrate, is an electrically conductive plastic substrate KS; iii) heating the at least one electrically conductive plastic substrate KS by means of resistance heating. The invention provides a curing method with lower energy consumption and lower investment costs, which method more particularly permits substrates having different thermal longitudinal expansion coefficients to be structurally connected by means of heat-curing adhesive compositions and enables lower tension in the cured adhesive compositions.