LASER-CUTTING METHOD AND LASER-CUTTING INSTALLATION
A method for laser cutting a workpiece having a thickness of less than 6 mm includes the steps of directing a first laser beam, a second laser beam, and a gas jet at an entrance surface of the workpiece such that the first and second laser beams at least partially overlap one another on the workpiec...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | A method for laser cutting a workpiece having a thickness of less than 6 mm includes the steps of directing a first laser beam, a second laser beam, and a gas jet at an entrance surface of the workpiece such that the first and second laser beams at least partially overlap one another on the workpiece. The first laser beam has a smaller focus diameter than the second laser beam, a beam parameter product of the first laser beam is at most 5 mm*mrad, and a power proportion of the second laser beam of a total laser power is less than 20%. A cutting kerf with a broken cutting edge is formed on the entrance surface of the workpiece. |
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