HOUSING ASSEMBLY FOR ACCOMMODATING PRINTED CIRCUIT BOARDS

The present disclosure relates to a housing assembly for accommodating printed circuit boards (PCBs). The housing assembly comprises a first housing portion configured to accommodate a first PCB, a second housing portion configured to accommodate a second PCB, and a separating portion for separating...

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Bibliographische Detailangaben
Hauptverfasser: MELDER, Ulrich, SCHOEPP, Hans, FRITZENSCHAFT, Janina, RIEGELSBERGER, Fabian
Format: Patent
Sprache:eng ; fre ; ger
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Zusammenfassung:The present disclosure relates to a housing assembly for accommodating printed circuit boards (PCBs). The housing assembly comprises a first housing portion configured to accommodate a first PCB, a second housing portion configured to accommodate a second PCB, and a separating portion for separating the first housing portion from the second housing portion. The separating portion comprises a first separating region in which the first housing portion and the second housing portion overlap and a second separating region that extends beyond the second housing portion and covers the first housing portion. The second separating region comprises one or more convection openings.