METHOD FOR MANUFACTURING AN INTEGRATED SYSTEM INCLUDING A CAPACITIVE PRESSURE SENSOR AND AN INERTIAL SENSOR, AND INTEGRATED SYSTEM

METHOD FOR MANUFACTURING AN INTEGRATED SYSTEM INCLUDING A CAPACITIVE PRESSURE SENSOR AND AN INERTIAL SENSOR, AND INTEGRATED SYSTEM

Method for manufacturing a micro-electro-mechanical system, MEMS, (50) integrating a first MEMS device (51) and a second MEMS device (52). The first MEMS device is a capacitive pressure sensor and the second MEMS device is an inertial sensor. The steps of manufacturing the first and second MEMS devi...

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Bibliographische Detailangaben
Hauptverfasser: VILLA, Flavio Francesco, FERRARI, Paolo, CORSO, Lorenzo, LAMAGNA, Luca, NICOLI, Silvia
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Zusammenfassung:Method for manufacturing a micro-electro-mechanical system, MEMS, (50) integrating a first MEMS device (51) and a second MEMS device (52). The first MEMS device is a capacitive pressure sensor and the second MEMS device is an inertial sensor. The steps of manufacturing the first and second MEMS devices are, at least partly, shared with each other, resulting in a high degree of integration on a single die, and allowing to implement a manufacturing process with high yield and controlled costs.