DEVICE AND METHOD FOR FORMING CONDUCTIVE MICRO-PATTERNS
The present invention relates to an apparatus and a method for forming a conductive fine pattern, wherein all processes are simplified using an inkjet printing method, and thus a substrate having a fine pattern smaller than 20 µm can be quickly manufactured. To this end, the method for forming a con...
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| creator | KIM, Seog-soon |
| description | The present invention relates to an apparatus and a method for forming a conductive fine pattern, wherein all processes are simplified using an inkjet printing method, and thus a substrate having a fine pattern smaller than 20 µm can be quickly manufactured. To this end, the method for forming a conductive fine pattern according to the present invention forms a conductive fine pattern on a substrate having identical surface energy by using inkjet printing for printing ink along a path. The method for forming a conductive fine pattern comprises a droplet ejection process of simultaneously performing: discharging photocurable ink at the front side of the path; discharging volatile ink containing minute metal particles at the rear side of the path; and applying light energy to the discharged photocurable ink, wherein the light energy is configured to have a light intensity such that: the photocurable ink is semi-cured and ejected in a gel state on the substrate, and thus forms a boundary with liquid volatile ink ejected on the substrate; and the photocurable ink is completely cured after the ejection of both the photocurable ink and the volatile ink is completed. |
| format | Patent |
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To this end, the method for forming a conductive fine pattern according to the present invention forms a conductive fine pattern on a substrate having identical surface energy by using inkjet printing for printing ink along a path. The method for forming a conductive fine pattern comprises a droplet ejection process of simultaneously performing: discharging photocurable ink at the front side of the path; discharging volatile ink containing minute metal particles at the rear side of the path; and applying light energy to the discharged photocurable ink, wherein the light energy is configured to have a light intensity such that: the photocurable ink is semi-cured and ejected in a gel state on the substrate, and thus forms a boundary with liquid volatile ink ejected on the substrate; and the photocurable ink is completely cured after the ejection of both the photocurable ink and the volatile ink is completed.</description><language>eng ; fre ; ger</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COLOUR PRINTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINING MACHINES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PRINTING ; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES ; SPRAYING OR ATOMISING IN GENERAL ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2023</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230301&DB=EPODOC&CC=EP&NR=4142437A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20230301&DB=EPODOC&CC=EP&NR=4142437A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIM, Seog-soon</creatorcontrib><title>DEVICE AND METHOD FOR FORMING CONDUCTIVE MICRO-PATTERNS</title><description>The present invention relates to an apparatus and a method for forming a conductive fine pattern, wherein all processes are simplified using an inkjet printing method, and thus a substrate having a fine pattern smaller than 20 µm can be quickly manufactured. To this end, the method for forming a conductive fine pattern according to the present invention forms a conductive fine pattern on a substrate having identical surface energy by using inkjet printing for printing ink along a path. The method for forming a conductive fine pattern comprises a droplet ejection process of simultaneously performing: discharging photocurable ink at the front side of the path; discharging volatile ink containing minute metal particles at the rear side of the path; and applying light energy to the discharged photocurable ink, wherein the light energy is configured to have a light intensity such that: the photocurable ink is semi-cured and ejected in a gel state on the substrate, and thus forms a boundary with liquid volatile ink ejected on the substrate; and the photocurable ink is completely cured after the ejection of both the photocurable ink and the volatile ink is completed.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COLOUR PRINTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINING MACHINES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PRINTING</subject><subject>PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2023</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDB3cQ3zdHZVcPRzUfB1DfHwd1Fw8w8CYV9PP3cFZ38_l1DnEM8wVwVfT-cgf90Ax5AQ1yC_YB4G1rTEnOJUXijNzaDg5hri7KGbWpAfn1pckJicmpdaEu8aYGJoYmRibO5oaEyEEgDhpSfB</recordid><startdate>20230301</startdate><enddate>20230301</enddate><creator>KIM, Seog-soon</creator><scope>EVB</scope></search><sort><creationdate>20230301</creationdate><title>DEVICE AND METHOD FOR FORMING CONDUCTIVE MICRO-PATTERNS</title><author>KIM, Seog-soon</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP4142437A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2023</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COLOUR PRINTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINING MACHINES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PRINTING</topic><topic>PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>KIM, Seog-soon</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIM, Seog-soon</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEVICE AND METHOD FOR FORMING CONDUCTIVE MICRO-PATTERNS</title><date>2023-03-01</date><risdate>2023</risdate><abstract>The present invention relates to an apparatus and a method for forming a conductive fine pattern, wherein all processes are simplified using an inkjet printing method, and thus a substrate having a fine pattern smaller than 20 µm can be quickly manufactured. To this end, the method for forming a conductive fine pattern according to the present invention forms a conductive fine pattern on a substrate having identical surface energy by using inkjet printing for printing ink along a path. The method for forming a conductive fine pattern comprises a droplet ejection process of simultaneously performing: discharging photocurable ink at the front side of the path; discharging volatile ink containing minute metal particles at the rear side of the path; and applying light energy to the discharged photocurable ink, wherein the light energy is configured to have a light intensity such that: the photocurable ink is semi-cured and ejected in a gel state on the substrate, and thus forms a boundary with liquid volatile ink ejected on the substrate; and the photocurable ink is completely cured after the ejection of both the photocurable ink and the volatile ink is completed.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLOUR PRINTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES SPRAYING OR ATOMISING IN GENERAL STAMPS TRANSPORTING TYPEWRITERS |
| title | DEVICE AND METHOD FOR FORMING CONDUCTIVE MICRO-PATTERNS |
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