DEVICE AND METHOD FOR FORMING CONDUCTIVE MICRO-PATTERNS

The present invention relates to an apparatus and a method for forming a conductive fine pattern, wherein all processes are simplified using an inkjet printing method, and thus a substrate having a fine pattern smaller than 20 µm can be quickly manufactured. To this end, the method for forming a conductive fine pattern according to the present invention forms a conductive fine pattern on a substrate having identical surface energy by using inkjet printing for printing ink along a path. The method for forming a conductive fine pattern comprises a droplet ejection process of simultaneously performing: discharging photocurable ink at the front side of the path; discharging volatile ink containing minute metal particles at the rear side of the path; and applying light energy to the discharged photocurable ink, wherein the light energy is configured to have a light intensity such that: the photocurable ink is semi-cured and ejected in a gel state on the substrate, and thus forms a boundary with liquid volatile ink ejected on the substrate; and the photocurable ink is completely cured after the ejection of both the photocurable ink and the volatile ink is completed.