ELECTRONIC PACKAGE AND METHOD FOR MANUFACTURING THE SAME

The present invention relates to an electronic package and a method for manufacturing the same. The electronic package comprises: a first substrate comprising a first dielectric layer; a second substrate comprising a second dielectric layer, the second substrate being mutually fixated relative to the first substrate; a first electronic component arranged in between the first and second substrate, the first electronic component having a plurality of first terminals; and a plurality of first inner contacts, each first inner contact being arranged on the first dielectric layer or the second dielectric layer, wherein each first terminal among the plurality of first terminals is electrically connected to at least one first inner contact among the plurality of first inner contacts, and wherein each first inner contact among the plurality of first inner contacts is electrically connected to at least one first terminal among the plurality of first terminals.The electronic package is characterized in that it further comprises a plurality of first partial vias, each first partial via having a side wall and being arranged in the first or second dielectric layer, wherein each first inner contact among the plurality of first inner contacts is electrically connected to at least one first partial via among the plurality of first partial vias, wherein the side wall of each first partial via among the plurality of first partial vias, and/or a metal contact layer arranged on said side wall, forms at least part of a first bottom contact of the electronic package and forms at least part of a mounting surface of the electronic package.