ELECTRIC ASSEMBLY WITH COOLING CIRCUIT
The present invention relates to an electronic assembly (1) comprising an electronic system (3) and a cooling circuit (8) wherethrough a coolant fluid circulates, the coolant fluid (8) being formed by a tube (5) arranged in a housing (6) in contact with at least one portion of the electronic system...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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Zusammenfassung: | The present invention relates to an electronic assembly (1) comprising an electronic system (3) and a cooling circuit (8) wherethrough a coolant fluid circulates, the coolant fluid (8) being formed by a tube (5) arranged in a housing (6) in contact with at least one portion of the electronic system (3), characterised in that the tube (5) of the cooling circuit (8) is a tube (5) pressed into the housing (6), a thermally conductive material (4) being arranged between the tube (5) and the housing. |
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