METHOD FOR PRODUCING RESIN COMPOSITION LAYER, RESIN COMPOSITION LAYER PRODUCED BY SAID PRODUCTION METHOD, AND COMPOSITE MOLDED ARTICLE INCLUDING SAID RESIN COMPOSITION LAYER

A method for producing a resin composition layer, the resin composition layer being formed of a resin composition that includes an agglomerated inorganic filler and a thermosetting resin, the method comprising step (a) and step (b), described below: (a) a step in which a pressing process is performe...

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Bibliographische Detailangaben
Hauptverfasser:	SAWAMURA, Toshiyuki, KOGA, Yuuya, WATANABE, Akira, TANAKA, Toshiyuki
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	A method for producing a resin composition layer, the resin composition layer being formed of a resin composition that includes an agglomerated inorganic filler and a thermosetting resin, the method comprising step (a) and step (b), described below: (a) a step in which a pressing process is performed on a carrier film and a sheet formed with the resin composition on the carrier film, under conditions including a pressing temperature of 0°C or greater and 110°C or less and a pressing pressure of 40 MPa or greater and 1000 MPa or less; and (b) a step in which a pressing process is performed on the sheet resulting from step (a), under conditions including a pressing temperature of 70°C or greater and 250°C or less and a pressing pressure of 3 MPa or greater and 100 MPa or less, to produce the resin composition layer.