HIGH-STRENGTH SOLDER-PLATED AL-MG-SI ALUMINUM MATERIAL

The present disclosure provides an aluminium material for the manufacture of high-strength, soldered components, including an aluminium alloy. After soldering, the aluminium material is in materially-bonded contact with at least one solder layer. The object of providing an aluminium material is to p...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	LENTZ, Martin Christoph, SASS, Volker, EIGEN, Nico
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING FERROUS OR NON-FERROUS ALLOYS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	The present disclosure provides an aluminium material for the manufacture of high-strength, soldered components, including an aluminium alloy. After soldering, the aluminium material is in materially-bonded contact with at least one solder layer. The object of providing an aluminium material is to provide not only good soldering properties and formability, but also high strength. This is achieved because the aluminium alloy of the aluminium material has a solidus temperature, and the aluminium material has an increase in yield strength compared to the state after soldering and cooling.