HEAT DISSIPATION DEVICE AND ELECTRONIC APPARATUS

A heat radiating device (70) includes a plurality of heat pipes (73) including respective heat receiving portions (73a) that are located above an integrated circuit (50a) and that are thermally connected to the integrated circuit (50a), and a heat sink (71) connected to the plurality of heat pipes (...

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Bibliographische Detailangaben
Hauptverfasser:	TSUCHIDA, Shinya, SASAKI, Chiyoshi, OOTORI, Yasuhiro, AOKI, Keiichi, SABELSTROM, Nils
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS
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Beschreibung
Zusammenfassung:	A heat radiating device (70) includes a plurality of heat pipes (73) including respective heat receiving portions (73a) that are located above an integrated circuit (50a) and that are thermally connected to the integrated circuit (50a), and a heat sink (71) connected to the plurality of heat pipes (73). A plurality of the heat receiving portions (73a) are aligned with each other in a left-right direction and are in contact with the heat receiving portions (73a) of adjacent ones of the heat pipes (73). The heat receiving portions (73a) each have a first width (W1) in an upward-downward direction and have a second width (W2) smaller than the width (W1) in the left-right direction. With this, cooling performance for the integrated circuit can be improved.