ELEMENT-MOUNTED BOARD AND METHOD FOR MANUFACTURING ELEMENT-MOUNTED BOARD

An element-mounted board of the present embodiment includes a heat-dissipating plate (1) in which aluminum or magnesium-containing metal layers are formed on both front and back surfaces of a flat plate-shaped metal-silicon carbide complex including aluminum or magnesium, and an electronic element (...

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Bibliographische Detailangaben
Hauptverfasser: GOTO, Daisuke, OTA, Hiroaki
Format: Patent
Sprache:eng ; fre ; ger
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Beschreibung
Zusammenfassung:An element-mounted board of the present embodiment includes a heat-dissipating plate (1) in which aluminum or magnesium-containing metal layers are formed on both front and back surfaces of a flat plate-shaped metal-silicon carbide complex including aluminum or magnesium, and an electronic element (11) including a ceramic plate (12), which is mounted on one surface (main surface 3A) side of the heat-dissipating plate 1, in which a flatness of the other surface (main surface 3B) of the heat-dissipating plate 1 is 600 um or less.