SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIODES
The present disclosure relates to a method for manufacturing a display device, and one particular implementation relates to a substrate chuck for self-assembling micro LEDs. The substrate chuck may include a first frame having a hole at a central portion thereof, a second frame having a hole at a ce...
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creator | RHO, Junghun CHOI, Bongwoon YANG, Inbum JUNG, Imdeok |
description | The present disclosure relates to a method for manufacturing a display device, and one particular implementation relates to a substrate chuck for self-assembling micro LEDs. The substrate chuck may include a first frame having a hole at a central portion thereof, a second frame having a hole at a central portion thereof and disposed to overlap the first frame, a frame moving part configured to transfer the second frame such that the second frame presses the substrate while the substrate is disposed between the first and second frames, and an auxiliary clamp configured to additionally press the second frame toward the substrate while the second frame is pressing the substrate. |
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The substrate chuck may include a first frame having a hole at a central portion thereof, a second frame having a hole at a central portion thereof and disposed to overlap the first frame, a frame moving part configured to transfer the second frame such that the second frame presses the substrate while the substrate is disposed between the first and second frames, and an auxiliary clamp configured to additionally press the second frame toward the substrate while the second frame is pressing the substrate.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2024</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240612&DB=EPODOC&CC=EP&NR=4131352B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20240612&DB=EPODOC&CC=EP&NR=4131352B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RHO, Junghun</creatorcontrib><creatorcontrib>CHOI, Bongwoon</creatorcontrib><creatorcontrib>YANG, Inbum</creatorcontrib><creatorcontrib>JUNG, Imdeok</creatorcontrib><title>SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIODES</title><description>The present disclosure relates to a method for manufacturing a display device, and one particular implementation relates to a substrate chuck for self-assembling micro LEDs. 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The substrate chuck may include a first frame having a hole at a central portion thereof, a second frame having a hole at a central portion thereof and disposed to overlap the first frame, a frame moving part configured to transfer the second frame such that the second frame presses the substrate while the substrate is disposed between the first and second frames, and an auxiliary clamp configured to additionally press the second frame toward the substrate while the second frame is pressing the substrate.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
recordid | cdi_epo_espacenet_EP4131352B1 |
source | esp@cenet |
subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
title | SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIODES |
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