SUBSTRATE CHUCK FOR SELF-ASSEMBLING SEMICONDUCTOR LIGHT EMITTING DIODES

The present disclosure relates to a method for manufacturing a display device, and one particular implementation relates to a substrate chuck for self-assembling micro LEDs. The substrate chuck may include a first frame having a hole at a central portion thereof, a second frame having a hole at a ce...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	RHO, Junghun, CHOI, Bongwoon, YANG, Inbum, JUNG, Imdeok
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	The present disclosure relates to a method for manufacturing a display device, and one particular implementation relates to a substrate chuck for self-assembling micro LEDs. The substrate chuck may include a first frame having a hole at a central portion thereof, a second frame having a hole at a central portion thereof and disposed to overlap the first frame, a frame moving part configured to transfer the second frame such that the second frame presses the substrate while the substrate is disposed between the first and second frames, and an auxiliary clamp configured to additionally press the second frame toward the substrate while the second frame is pressing the substrate.